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Datasheets for HP 3070 Series 3 Family![]()
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HP delivers time-saving innovations that help you tackle your toughest high-tech test problems with ease. The HP 3070 Series 3 family of board test systems combines fast test throughput with quick program development tools to give you the best combination of capabilities to save that most precious commodity: TIME.
Time-to-market. Time-to-volume. Time-to-profit. HP knows time is an important factor in your decision. Like everyone today, it seems, there's not enough time to get things done right. If this sounds like your area of interest, the HP 3070 Series 3 can help you.
HP 3070 Series 3 board test systems combine low purchase prices with innovations such as HP TestJet* technology, HP MagicTest* software, HP Pay-Per-Use technology, and the HP Thruput Multiplier technique that reduce the cost and increase the effectiveness of test. Whether you need unpowered process test, traditional in-circuit test or high-performance combinational test, the Series 3 family provides affordable entry points across a range of systems. And Series 3 systems are designed to keep your on-going test costs low with high quality, high fault coverage tests, fast test throughput, reliable system hardware, and comprehensive programming.
Today, many manufacturers have facilities spread throughout the world. Although each site may utilize a different system within the HP 3070 family, resources and processes may be easily shared. A single site can use a combination of systems to optimize test for the mix of boards and manufacturing processes.
* HP TestJet technology is a vectorless testing technique for reliably and automatically detecting solder opens on SMT devices installed on printed circuit boards. HP TestJet technology is protected under U.S. patent number 5,254,953. HP MagicTest technology is a mathematical technique for automatically providing in-circuit tests and component-level diagnostics for analog cluster circuits having as little as 50% probe access. The HP MagicTest patent is pending.
This product family includes
Analog Testing
Node Capacity
Up to 5184 nodes. See data sheet for each product.
Opens Testing
HP TestJet Technology provides Opens Test for ICs, connectors, switches, fuses Minimum IC package size: 8.13 x 10.2 mm Maximum IC package size: 63.5 x 63.5 mm
Shorts Testing
Programmable threshold: 2-1000 ohms
Analog Measurements
Resistance: 0.1 ohm to 10 Mohms Capacitance: 10 pF to 10 mF Inductance: 5 mH to 100 H
Analog Tests
Structured test for device types: diode, zener diode, transistor, FET, fuse, jumper, switch, potentiometer
Digital Testing
Capability varies with system model. See data sheet for each product.
Standard System Controller
HP PA-RISC Controller 64 MB RAM 17" high resolution color monitor 2 GB SCSI disk 2 GB digital audio tape drive Ethernet LAN, HP-IB, RS-232 interfaces
Environmental Requirements
______________________________________________ Operating Operating Storage Temperature Humidity Temperature ______________________________________________ Testhead: 0 to 40 5 to 80% -40 to 70 degrees C non-condensing degrees C Support Bay: 0 to 40 5 to 80% -40 to 70 degrees C non-condensing degrees C Controller: 5 to 45 20 to 80% -40 to 65 degrees C non-condensing degrees C _______________________________________________
No literature is available online at this time.
HP 3072 Process Test System, 5184 nodes HP 3172 Process Test System, 2592 nodes HP 3272 Process Test System, 1296 nodes HP 3073 Low-Cost Combinational Test System, 5184 nodes HP 3173 Low-Cost Combinational Test System, 2592 nodes HP 3273 Low-Cost Combinational Test System, 1296 nodes HP 3075 High-Performance Combinational Test System, 5184 nodes HP 3175 High-Performance Combinational Test System, 2592 nodes HP 3275 High-Performance Combinational Test System, 1296 nodes HP 3079 CT Combinational Communications Test System HP 3179 CT Low-Cost Combinational Communications Test System HP 3279 CT Functional Communications Test System HP 3070 Pay-Per-Use Test System, 5184 nodes HP 3170 Pay-Per-Use Test System, 2592 nodes Consult with your HP Board Test Field Engineer to configure a system to meet your specific needs.
Page Updated: Friday January 29 00:06:45 UTC 1999