HP 3272 Series 3 process test system, 1296-nodes

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HP 3272 Series 3 process test system: small footprint and small price.

Process test systems are often used in-line to detect and isolate Surface Mount Technology (SMT) manufacturing process defects.

The HP 3272 Series 3 Process Test System simplifies board test and reduces the cost while retaining the thorough fault coverage necessary for today's high-tech boards. HP provides the flexibility to use innovative test technologies such as HP MagicTest1 technology or HP TestJet2 technology to detect a broad spectrum of manufacturing defects, so boards can be fixed prior to final assembly, further reducing expensive rework. HP TestJet technology is a vectorless testing technique for reliably and automatically detecting solder opens on SMT devices installed on printed circuit boards.

Incorporating HP's revolutionary HP TestJet technology, this board test system easily finds solder opens. HP TestJet combined with precision analog in-circuit capability means that the test systems can detect a broad spectrum of manufacturing defects, reducing the need for expensive end-of-line test.


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