HP BV3000 Automated Optical Inspection System

HP Automated Optical Inspection Solutions deliver: Consistent reliable, repeatable results ... Improved early fault coverage ... High throughput ... Lower cost of test

The HP BV3000 is an in-line, post-reflow, automated optical inspection test cell for detecting common manufacturing process faults, such as component placement and gross solder defects on SMT printed circuit board assemblies. The system identifies:

Missing or extra parts
Misaligned parts
Tombstone or billboard parts
Rotated and reversed polarity parts
Wrong component size
Excess solder and solder bridges
Component leads that are lifted or bent

The HP BV3000 system combines all the key ingredients needed for an early, reliable visual inspection solution:

Intense fiber optic lighting, unaffected by ambient light changes, that enables capture of clear images for reliable inspection results.
Charge-coupled device (CCD) cameras, using telecentric lenses which reduce the effects of parallax, and capture a well-defined image for repeatable inspection results.
Robust algorithms that quickly analyze the detailed image data and return quality results.

The HP BV3000 systems detect defects on PCBAs with virtually any type of SMT or PTH component. This system is an excellent alternative to human visual inspection in high-volume lines or in low-volume/high-mix lines, where frequent changes of board type make it difficult for human inspectors to do a good job.

Reduce manufacturing costs with high fault coverage and pinpoint diagnostics...

The HP BV3000 Systems cover most of the process fault spectrum, including shorts, opens, insufficient/excess solder, misaligned and missing components, reversed polarized capacitors, and even unreliable solder joints that might escape electrical tests. All defects are pinpointed to a specific solder joint and component. The HP BV3000 eliminates visual inspection, reduces repair costs at in-circuit and functional test, and prevents field failures.

Get your products to market faster with minimal test development effort...

The HP BV3000 provides short test development with no fixturing, which is particularly important during prototyping or in a "high-mix, low-volume" board manufacturing environment. New boards get to production quicker. Low volume boards get tested at a lower cost.

[ Features ]

High fault coverage of PCBAs with limited test access
Accurate inspection with limited visual access
Fast test setup requiring no fixturing
Test development times typically one day or less
Accurate diagnostics pinpoint exact location of defects
High defect-call repeatability, an order of magnitude beyond visual inspection
Automatic board handling with nearly zero lot changeover time

[ Specifications ]

Defects detected:
Misaligned parts
Missing components
Tombstone or billboard parts
Excess solder and solder bridges
Rotated and reversed polarity parts
Wrong component size
Component leads that are lifted or bent

Board handling size:
85mm x 85mm to 450mm x 330mm (3.3" x 3.3" to 17.5" x 12.8") 
1mm to 2mm thick (0.04" to 0.08")
Side clearance of 3mm (0.12") on parallel edges
Top clearance of 25mm (0.98") and bottom clearance of 7mm (0.28")
Board fiducials are preferred.  If unavailable, system will 
align on solder joints.

Fields of view:
Fastest throughput: 40 micron/pixel camera setting
Highest resolution: 20 micron/pixel camera setting

Inspection Speed:
Approximately 600ms per field of view
Board Handling Time: 2-4s (load and unload)
Board Alignment Time: 1-3s, depends on board size

Test development time (typical)
1-2 hours to translate and verify CAD data for a new board design
4-8 hours to set up board (including thresholds and alignment)

System Operational Modes
Operator Mode: Used for normal fully automatic inspection.  Can use 
barcode for board identification.
Technician Mode: Allows complete control of the system, including 
algorithm setup and debug, CAD data generation, system diagnostics 
and calibration.
Audit Mode: Provides a review of an inspected board to the operators, 
either by complete image or by individual components.
System Alignment Mode: The system xy actuators automatically 
realign to guarantee consistent test results.

Test Software: Digitized images of the PCBA are automatically 
generated and analyzed.  Feature detection is determined by the 
presence or absence of image characteristics associated with specific 
discrete defects, based on CAD data and a library of standard 
component algorithms supporting the following device types:
Ceramic chip capacitor (with terminal)
Chip resistor (with terminal)
Molded tantalum capacitor (with clear polarity band)
Inductor (multi-layer and molded case)
Crystal
Oscillator
SOM resistor array
SMD resistor array
Rectangular rectifier
SOT transistor
DPAK transistor
J-lead (missing or misaligned)
Gull wing (missing, misaligned and bridging)
				
Test Reports
Defect report: Includes device name, defect type, board name, etc
Real-time report: Graphical display on system monitor showing exact defect 
locations for paperless repair
SPM report: Statistical Process Monitoring. Charts are configured 
by assembly, by panel number 
and by operator.  Real-time production and defect detection statistics 
are produced.
Small footprint: 1.1m x 0.9m, 1.6m high (3.6ft x 2.95ft, 5.25ft high)
Operating weight: approx 650kg (1433lb)

Specifications subject to change without notice. (11/1/98)

[ Ordering ]

HP BV3000 Family of Automated Optical Inspection Systems Model HP BV3100 Single-camera. Center camera fixed above device under test Model HP BV3500 5-camera version. Center camera and four oblique cameras allow for detection of bridges and lifted lead defects. Consult with your HP Field Engineer to configure a system to meet your specific needs.

[ Key Literature ]

No literature is available online at this time.

[ Assistance ]

To help you make the right product choices

Local Sales Office

[ Related ]

Related Information:

HP 5DX Series 2 Automated Process Test System

Printed Circuit Board Test and Inspection Systems HP offers a full range of PCBA test and inspection products including electrical process test, structural process test and telecom access loop functional test to save you time and money.

Related product families available online:

Structural Process Test Systems