HP 5DX Automated Process Test System

The HP 5DX Automated Test Systems use cross-sectional X-ray imaging, or laminography, to test solder joints on printed circuit board assemblies (PCBA's). The systems detect defects on single- and double-sided PCBA's with virtually any type of SMT or PTH component, including BGA's. And since X-ray laminography does not require physical contact or visual access to solder joints on the board, these systems are an excellent solution for testing board configurations with limited test access.

The HP 5DX Systems cover most of the process fault spectrum, including shorts, opens, insufficient/excess solder, misaligned and missing components, reversed polarized capacitors, and evenunreliable solder joints that might escape electrical tests. All defects are pinpointed to a specific solder joint and component. The HP 5DX eliminates visual inspection, reduces repair costs at in-circuit and functional test, and prevents field failures.

The HP 5DX provides short test development with no fixturing, which is particularly important during prototyping or in a "high-mix, low-volume" board manufacturing environment. New boards get to production quicker. Low volume boards get tested at a lower cost.

The HP 5DX system measures solder-joint dimensions and features at production speeds. Real time process measurement data and corresponding analysis tools provided with the 5DX help PCBA manufacturers reach mature process yields quickly and maintain high yields.

Product Features

• 99% fault coverage of PCBAs with limited test access

• Accurate inspection of solder joints with limited visual access

• Fast test setup requiring no fixturing

• Test development times less than one week

• Accurate diagnostics pinpoint exact location of defects

• Double-sided assemblies tested in one pass through the system

• Quantitative measurements of key solder-joint dimensions and features

• Detection of unreliable, marginal solder joints

• High defect-call repeatability, an order of magnitude beyond visual inspection

• Automatic board handling with nearly zero lot changeover time

Product Specifications

	Shorts			Insufficient solder	Solder balls
	Opens			Excess solder		Excess voiding
	Missing components	Misalignment		Poor fillet shape

	457 x 465 mm (18.0 x 18.3 inches) maximum 

	445 x 445 mm (17.5 x 17.5 inches) maximum 

	Three fields of view with a range of 5 to 20 mm (0.2 to 0.8 inches)

	Test algorithm modules of the HP Four Pi 5DX include both feature
	detection and quantitative measurements.  Algorithms are available 
	for the following component types:

	Gullwing	Chip/MELF capacitors	SOT             SMT Connectors
	J lead		Chip/MELF resistors	Paste		PTH		
	TAB		Chip/MELF diodes	Sockets		LCC	
			

	Measurements:
		printed, files, graphical, statistical

   	Defects:
		board side,device designator, pin number, defect type

	Graphical plot:
		pinpoints defect locations on board layout

	SPC capability:
		full set of tools including control charts, histograms, 
		Pareto charts

Product Ordering Information

HP Four Pi 5DX	Automated Process Test System

HP E7201A       Four Pi 5DX System Model 5100
HP E7202A       Four Pi 5DX System Model 5200
HP E7203A       Four Pi 5DX System Model 5300
HP E7236A       Four Pi CIMBridge CAD Translation Module
HP E7251A       Four Pi Consulting
HP E7233A       Four Pi GERBERLink Software
HP E7250A       Four Pi Solder-joint measurement service
HP E7232A       Four Pi SPCLink Workstation
HP E7252A       Four Pi System implementation service


Consult with your HP Field Engineer to configure a system to meet
your specific needs.

To help you make the right instrument choices

Your Field Sales Engineer is ready to answer your questions about specifications, applications and ordering. Find your Field Sales Engineer at your Local Sales Office.

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