Advanced technologies have given the Company a competitive edge over traditional approaches to semiconductors. Combining lithium energy cells with low-power CMOS ICs powers the chips for the useful life of the equipment. Direct laser writing enhances chip capabilities with high levels of precision and unique identities. Special packaging gives improved functionality to silicon chips.
In its 14-year history, Dallas Semiconductor has developed 311 proprietary base products with over 2,000 variations shipped to more than 15,000 customers worldwide. A direct sales force and distribution network sell to original equipment manufacturers (OEMs) of personal computers and workstations, scientific and medical equipment, industrial controls, automatic identification, telecommunications, consumer electronics, and other markets.
Sales for 1997 totaled $368 million. Dallas Semiconductor has 1,800 employees. On March 19, 1990, the Company started trading on the New York Stock Exchange under the symbol DS.
Technology
Dallas Semiconductor's special technologies make possible Soft Silicon™ solutions—dynamic, flexible, chip-based products that can be molded in the final manufacturing stages or during use. Soft Silicon is made possible by lithium energy and direct laser writing.
Lithium
Using micro energy management techniques, Dallas Semiconductor has reduced
power requirements to the point where a miniature lithium energy source powers
products for the useful life of the equipment. Chips are made virtually
crashproof with minimum current design techniques and special freshness seals that keep
lithium cells from expending any energy until power is applied for the first
time. Through these technologies, Dallas products remember data throughout their
operating life and can accept change.
Laser
Direct laser writing makes each chip unique at low cost. A sub-micron
positioning laser and control software developed at Dallas can engrave individual
chips with digital patterns. This ability to routinely alter, reconfigure, or
program individual chips after completion of wafer fabrication broadens the
application base of products having similar design. Direct laser writing allows
Dallas Semiconductor to develop highly accurate products for applications where
precision is paramount.
As a results of these Late Definition technologies, exact chip definition can be left to the OEM. Certain chips can even be defined and redefined by the end system itself.
Manufacturing and Facilities
In March 1987, the Company began production at its advanced wafer fabrication
facility, in which it produces high-performance CMOS integrated circuits with
sub-micron geometries. This facility processes six-inch wafers and utilizes an
automated modular process technology that provides substantial flexibility in
the manufacturing process and significantly reduces the number of persons
required for operation. Physical expansion of this facility was completed in 1989
and an additional wafer fabrication facility was completed in 1994. Additional
equipment is installed from time to time to support higher production volumes or
advanced processing needs. In September of 1998, the Company opened a new $10 million
facility to produce its proprietary 1-Wire™ products in a minimal package no bigger
than the chip itself.