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Micro SMD AN-1112		3.5 MB

micro SMD

A COST-EFFECTIVE PACKAGE MINIATURIZATION SOLUTION
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Micro SMD (Surface-Mount Device) is a chip-size package and was developed by National Semiconductor. It is the same size as the silicon chip and is available in 4-, 5-, and 8-I/O packages. The advantages of micro SMD compared with traditional leaded plastic packages include:

• Small footprint      
• High I/O density      
• Better electrical & thermal performance      
• Easy board assembly      
• Level 1 moisture sensitivity performance      
• Noise reduction