Ball Grid Array, micro SMD, Laminate CSP and Leadless Leadframe Package (LLP) Packages

Ball Grid Array

Ball Grid Array Package	Databook Information			Package Details including Marketing Drawings
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Ball Grid Array AN-1126	View	Download 141 KB	E-mail
EBGA				Package Details  Package Code: UA
FBGA				Package Details  Package Code: SM, SLC
PBGA				Package Details  Package Code: UC, U(X,X)

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Micro SMD (Surface-Mount Device) is a chip-size package and was developed by National Semiconductor. It is the same size as the silicon chip and is available in 4-, 5-, and 8-I/O packages. The advantages of micro SMD compared with traditional leaded plastic packages include:

• Small footprint      
• High I/O density      
• Better electrical & thermal performance      
• Easy board assembly      
• Level 1 moisture sensitivity performance      
• Noise reduction

micro SMD Package	Databook Information			Package Details including Marketing Drawings
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micro SMD Wafer Level Chip Scale Package AN-1112	View	Download 3.5 MB	E-mail	N/A
Drawings				Package Details Package Code: BP

Leadless Leadframe (LLP)	Databook Information			Package Details including Marketing Drawings
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Leadless Leadframe Package (LLP) AN-1187	View	Download 3.3 MB	E-mail	N/A
Drawings				Package Details Package Code: LD, LQ

Laminate CSP	Databook Information			Package Details including Marketing Drawings
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Laminate CSP Packages AN-1125	View	Download 4.2 MB	E-mail	N/A
Drawings				Package Details Package Code: SL, SLB