Package Name	Package Codes
Metal Leaded Chip Carrier, J Bend	AA
MQUAD	AW, MO
MicroSMD	BP
SIP	CA, C
Sidebrazed, Hermetic Dip (Metal Seal)	DH, D, DA
Leadless Chip Carrier (LCC)	EA, E
Leaded Hermetic Quad Packages	EL
Ceramic Flat Pack (Solder Seal)	FA, F
Dual Leadless Leadframe Package (LLP)	LD
Quad Leadless Leadframe Package (LLP)	LQ
Metal Can, TO-5/39/46	HA, H
CDIP	JA, J
Metal Can, Steel TO-3	KA, K, KC, KS
SO Narrow	MA, M
TSOP	MB, MBH, MBS, MDA, MDB
SSOP (300 mil wide)	ME
SOT23	MF, M3, M5
SC70	MG, M7
TSSOP Exposed Pad	MH, MXA
SOIC-Mini	MM
SOT223	MP
SSOP (150 mil wide)	MQ, MS, MSA, MSC, MQA, MEB, MEC, MED
SSOP-EIAJ Type II and III	MS
TSSOP (4.4 mm and 6.1 mm wide)	MT
SO Wide	MW, WM
MDIP	NA, N
LTCC with castilations	SA
LTCC with Solder Balls	SB
LTCC with Clip on Leads	SC
LTCC with Land Contacts	SD
Laminate CSP w/ land area contacts	SL, SLB
FBGA (flex BGA)	SM, SLC
TO220	TA, T
TO202	TB, P, PA
TO-252 (DPAK)	TD, DT
TO220-ISO	TF
TO263	TS, S
EBGA (Enhanced BGA)	UA
SBGA(Super BGA)	UB
PBGA (Plastic)	UC, U(X,X)
TBGA (Tape)	UD
CPGA (Ceramic Pin Grid Array)	UE, U
PPGA (Plastic Pin Grid Array)	UP
PLCC	VA, V
PQFP (t=2.0mm, pitch=0.5)	VC, V(X,X)
PQFP (t=2.0mm, pitch=0.65)	VD, V(X,X)
PQFP (t=2.0mm, pitch=0.8)	VE, V(X,X)
PQFP (t=2.0mm, pitch=1.0)	VF, V(X,X)
PQFP (t=2.7mm, pitch=0.5)	VH, V(X,X)
PQFP (t=2.7mm, pitch=0.65)	VI, V(X,X)
PQFP (t=2.7mm, pitch=0.8)	VJ, V(X,X)
PQFP (t=2.7mm, pitch=1.0)	VK, V(X,X)
PQFP (t=3.4mm, pitch=0.5)	VM, V(X,X)
PQFP (t=3.4mm, pitch=0.65)	VN, V(X,X)
PQFP (t=3.4mm, pitch=0.8)	VO, V(X,X)
PQFP (t=3.4mm, pitch=1.0)	VP, V(X,X)
TQFP (t=1.0mm, pitch=0.5)	VS, V(X,X)
TQFP (t=1.0mm, pitch=0.65)	VT, V(X,X)
TQFP (t=1.0mm, pitch=0.8)	VU, V(X,X)
LQFP (t=1.4mm, pitch=0.5)	VV, V(X,X)
LQFP (t=1.4mm, pitch=0.65)	VW, V(X,X)
LQFP (t=1.4mm, pitch=0.8)	VY, V(X,X)
Cerpack	WA, W
Cerquad	WQ, W
Ceramic SOIC	WG
TQFP Exposed Pad	YA
TO92	ZA, Z, R