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DS90CF366  Product Folder

+3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link-85 MHz
Generic P/N 90CF366
General
Description
Features Datasheet Package
& Models
Samples
& Pricing
Reliability
Metrics

Parametric Table Parametric Table
Temperature Min (deg C) -10 
Temperature Max (deg C) 70 
Supply Voltage (Volt) 3.30 
Pixel Clock Rate (MHz) 85 
Graphic Bits (bit)
DisplayType FPD 
Strobe Edge Falling 
Function Receiver 

Datasheet

TitleSize in KbytesDate
View Online

Download

Receive via Email
DS90CF386 DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link-85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link-85 MHz 404 Kbytes 28-May-03 View Online Download Receive via Email

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Package Availability, Models, Samples & Pricing

Part NumberPackageStatusModelsSamples &
Electronic
Orders
Budgetary PricingStd
Pack
Size
Package
Marking
TypePinsMSL/Lead-Free AvailabilityLead
Time
QtySPICEIBISQty$US each
DS90CF366MTDTSSOP48StatusFull productionN/AN/A24 Hour Samples
Buy Now
1K+$3.50rail
of
38
NSUZXYTT
DS90CF366MTD
BBBBB
3-5 weeks1000
DS90CF366 MDCUnpackaged DieFull productionN/AN/A   tray
of
N/A
-
N/A0
DS90CF366 MWCWaferFull productionN/AN/A   wafer jar
of
N/A
-
N/A0

Obsolete Parts

Obsolete PartAlternate Part or SupplierSourceLast Time Buy Date
DS90CF366MTDX
DS90CF366MTD
NATIONAL SEMICONDUCTOR
12/02/2003

General Description

The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/sec bandwidth) back into parallel 28 bits of CMOS/TTL data (24 bits of RGB and 4 bits of Hsync, Vsync, DE and CNTL). Also available is the DS90CF366 that converts the three LVDS data streams (Up to 1.78 Gbps throughput or 223 Megabytes/sec bandwidth) back into parallel 21 bits of CMOS/TTL data (18 bits of RGB and 3 bits of Hsync, Vsync and DE). Both Receivers' outputs are Falling edge strobe. A Rising edge or Falling edge strobe transmitter (DS90C385/DS90C365) will interoperate with a Falling edge strobe Receiver without any translation logic.

The DS90CF386 is also offered in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package which provides a 44 % reduction in PCB footprint compared to the 56L TSSOP package.

This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.

Features

  • 20 to 85 MHz shift clock support
  • Rx power consumption <142 mW (typ) @85MHz Grayscale
  • Rx Power-down mode <1.44 mW (max)
  • ESD rating >7 kV (HBM), >700V (EIAJ)
  • Supports VGA, SVGA, XGA and Single Pixel SXGA.
  • PLL requires no external components
  • Compatible with TIA/EIA-644 LVDS standard
  • Low profile 56-lead or 48-lead TSSOP package
  • DS90CF386 also available in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package

Reliability Metrics

Part Number Process Early Failure Rate - Rejects Sample Size (EFR) PPM * Rel. Rejects Device Hours Long Term Failure Rates (FITS) MTTF
DS90CF366 MDCCMOS721420014108000005226190940
DS90CF366 MWCCMOS721420014108000005226190940
DS90CF366MTDCMOS721420014108000005226190940
DS90CF366MTDXCMOS721420014108000005226190940

For more information on Reliablitity Metrics, please click here.


[Information as of 15-Jan-2004]