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DS90CF366
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DS90CF366| DS90CF366 Product Folder | 
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| General Description | Features | Datasheet | Package & Models | Samples & Pricing | Reliability Metrics | 
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| Title | Size in Kbytes | Date |  View Online |  Download |  Receive via Email | 
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| DS90CF386 DS90CF366 +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link-85 MHz, +3.3V LVDS Receiver 18-Bit Flat Panel Display (FPD) Link-85 MHz | 404 Kbytes | 28-May-03 | View Online | Download | Receive via Email | 
| If you have trouble printing or viewing PDF file(s), see Printing Problems. | 
| Part Number | Package | Status | Models | Samples & Electronic Orders | Budgetary Pricing | Std Pack Size | Package Marking | |||||
| Type | Pins | MSL/Lead-Free Availability | Lead Time | Qty | SPICE | IBIS | Qty | $US each | ||||
| DS90CF366MTD | TSSOP | 48 | Status | Full production | N/A | N/A |    | 1K+ | $3.50 | rail of 38 | NSUZXYTT DS90CF366MTD BBBBB | |
| 3-5 weeks | 1000 | |||||||||||
| DS90CF366 MDC | Unpackaged Die | Full production | N/A | N/A | tray of N/A | - | ||||||
| N/A | 0 | |||||||||||
| DS90CF366 MWC | Wafer | Full production | N/A | N/A | wafer jar of N/A | - | ||||||
| N/A | 0 | |||||||||||
| Obsolete Part | Alternate Part or Supplier | Source | Last Time Buy Date | 
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| DS90CF366MTDX | DS90CF366MTD | NATIONAL SEMICONDUCTOR | 12/02/2003 | 
| The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/sec bandwidth) back into parallel 28 bits of CMOS/TTL data (24 bits of RGB and 4 bits of Hsync, Vsync, DE and CNTL). Also available is the DS90CF366 that converts the three LVDS data streams (Up to 1.78 Gbps throughput or 223 Megabytes/sec bandwidth) back into parallel 21 bits of CMOS/TTL data (18 bits of RGB and 3 bits of Hsync, Vsync and DE). Both Receivers' outputs are Falling edge strobe. A Rising edge or Falling edge strobe transmitter (DS90C385/DS90C365) will interoperate with a Falling edge strobe Receiver without any translation logic. The DS90CF386 is also offered in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package which provides a 44 % reduction in PCB footprint compared to the 56L TSSOP package. This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces. | 
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| Part Number | Process | Early Failure Rate - Rejects | Sample Size (EFR) | PPM * | Rel. Rejects | Device Hours | Long Term Failure Rates (FITS) | MTTF | 
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| DS90CF366 MDC | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 | 
| DS90CF366 MWC | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 | 
| DS90CF366MTD | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 | 
| DS90CF366MTDX | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 | 
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