DS90LV001 Product Folder |
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| General Description |
Features | Datasheet | Package & Models |
Samples & Pricing |
Reliability Metrics |
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| Title | Size in Kbytes | Date | View Online |
Download |
Receive via Email |
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| DS90LV001 3.3V LVDS-LVDS Buffer | 396 Kbytes | 18-Apr-01 | View Online | Download | Receive via Email |
| DS90LV001 3.3V LVDS-LVDS Buffer (JAPANESE) |
522 Kbytes |
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If you have trouble printing or viewing PDF file(s), see Printing Problems. |
| Part Number | Package | Status | Models | Samples & Electronic Orders | Budgetary Pricing | Std Pack Size | Package Marking | |||||
| Type | Pins | MSL/Lead-Free Availability | Lead Time | Qty | SPICE | IBIS | Qty | $US each | ||||
| LVDS001EVK | evaluation board | Preliminary | N/A | N/A | 1+ | $50.00 | 1 | - | ||||
| N/A | 0 | |||||||||||
| DS90LV001TLD | LLP | 8 | Status | Full production | N/A | N/A | 1K+ | $0.80 | reel of 1000 | ZXYTT 001 | ||
| 3-5 weeks | 5000 | |||||||||||
| DS90LV001TLDX | LLP | 8 | Status | Full production | N/A | N/A | | 1K+ | $0.80 | reel of 4500 | ZXYTT 001 | |
| 3-5 weeks | 9000 | |||||||||||
| DS90LV001TM | SOIC NARROW | 8 | Status | Full production | N/A | ds90lv001tm.ibs | 1K+ | $0.80 | rail of 95 | NSXYTT LV001 TM | ||
| 3-5 weeks | 3000 | |||||||||||
| DS90LV001TMX | SOIC NARROW | 8 | Status | Full production | N/A | N/A | 1K+ | $0.80 | reel of 2500 | NSXYTT LV001 TM | ||
| 3-5 weeks | 5000 | |||||||||||
| DS90LV001 MDC | Unpackaged Die | Full production | N/A | N/A | tray of N/A | - | ||||||
| N/A | 0 | |||||||||||
| DS90LV001 MWC | Wafer | Full production | N/A | N/A | wafer jar of N/A | - | ||||||
| N/A | 0 | |||||||||||
The DS90LV001 LVDS-LVDS Buffer takes an LVDS input signal and provides an LVDS output signal. In many large systems, signals are distributed across backplanes, and one of the limiting factors for system speed is the "stub length" or the distance between the transmission line and the unterminated receivers on individual cards. Although it is generally recognized that this distance should be as short as possible to maximize system performance, real-world packaging concerns often make it difficult to make the stubs as short as the designer would like. The DS90LV001, available in the LLP (Leadless Leadframe Package) package, will allow the receiver to be placed very close to the main transmission line, thus improving system performance. A wide input dynamic range will allow the DS90LV001 to receive differential signals from LVPECL as well as LVDS sources. This will allow the device to also fill the role of an LVPECL-LVDS translator. An output enable pin is provided, which allows the user to place the LVDS output in TRI-STATE. The DS90LV001 is offered in two package options, an 8 pin LLP and SOIC. |
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| Part Number | Process | Early Failure Rate - Rejects | Sample Size (EFR) | PPM * | Rel. Rejects | Device Hours | Long Term Failure Rates (FITS) | MTTF |
|---|---|---|---|---|---|---|---|---|
| DS90LV001 MDC | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 |
| DS90LV001 MWC | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 |
| DS90LV001TLD | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 |
| DS90LV001TLDX | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 |
| DS90LV001TM | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 |
| DS90LV001TMX | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 |
| LVDS001EVK | CMOS7 | 2 | 14200 | 141 | 0 | 800000 | 5 | 226190940 |
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