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LMC8101 Product Folder

Rail-to-Rail Input and Output, 2.7V Op Amp in micro SMD package with Shutdown

Generic P/N 8101

Parametric Table

Temperature Min (deg C)	-40
Temperature Max (deg C)	85
Channels (Channels)	1
Input OutputType	R-R In and Out
Gain Bandwidth (MHz)	1
Slew Rate (Volts/usec)	1
SupplyCurrent Per Channel (mA)	.70
Supply Min (Volt)	2.70
Supply Max (Volt)	10
Offset Voltage (mV)	5

Max Input Bias Current (nA)	.0640
Output Current (mA)	49
Voltage Noise (nV/Hz)	36
Shut down	Yes
VCM Min from Neg Supply (Volt)	-.20
VCM Max from Pos Supply (Volt)	.20
Vout Min vs Negative Supply (Volt)	.0320
Vout Max vs Positive Supply (Volt)	-.03
Special Features

Datasheet

Title	Size in Kbytes	Date	View Online	Download	Receive via Email
LMC8101 Rail-to-Rail Input and Output, 2.7V Op Amp inmicro SMD package with Shutdown	711 Kbytes	5-Mar-02	View Online	Download	Receive via Email
LMC8101 Rail-to-Rail Input and Output, 2.7V Op Amp inmicro SMD package with Shutdown (JAPANESE)	401 Kbytes

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Package Availability, Models, Samples & Pricing

Part Number

Package

Status

Models

Samples &
Electronic
Orders

Budgetary Pricing

Std
Pack
Size

Package
Marking

Type

Pins

MSL/Lead-Free Availability

Lead
Time

Qty

SPICE

IBIS

Qty

$US each

LMC8101BP

microSMD

Status

Full production

LMC8101.MOD

N/A

1K+

$0.43

reel
of
250

XVA
I 2

11-13 weeks

15000

LMC8101BPX

microSMD

Status

Full production

LMC8101.MOD

N/A

1K+

$0.43

reel
of
3000

XVA
I 2

11-13 weeks

100000

LMC8101MM

MINI SOIC

Status

Full production

LMC8101.MOD

N/A

1K+

$0.43

reel
of
1000

ZXTT
A11

15-17 weeks

10000

LMC8101MMX

MINI SOIC

Status

Full production

LMC8101.MOD

N/A

1K+

$0.43

reel
of
3500

ZXTT
A11

15-17 weeks

50000

LMC8101 MDC

Unpackaged Die

Full production

LMC8101.MOD

N/A

tray
of
N/A

N/A

LMC8101 MWC

Wafer

Full production

LMC8101.MOD

N/A

wafer jar
of
N/A

N/A

The LMC8101 is a Rail-to-Rail Input and Output high performance CMOS operational amplifier. The LMC8101 is ideal for low voltage (2.7V to 10V) applications requiring Rail-to-Rail inputs and output. The LMC8101 is supplied in the die sized micro SMD as well as the 8 pin MSOP packages. The micro SMD package requires 75% less board space as compared to the SOT23-5 package. The LMC8101 is an upgrade to the industry standard LMC7101.

The LMC8101 incorporates a simple user controlled methodology for shutdown. This allows ease of use while reducing the total supply current to 1nA typical. This extends battery life where power saving is mandated. The shutdown input threshold can be set relative to either V⁺ or V^- using the SL pin (see Application Note section for details).

Other enhancements include improved offset voltage limit, three times the output current drive and lower 1/f noise when compared to the industry standard LMC7101 Op Amp. This makes the LMC8101 ideal for use in many battery powered, wireless communication and Industrial applications.

Features

V_S = 2.7V, T_A = 25°C, R_L to V⁺/2, Typical values unless specified.

Rail-to-Rail Inputs
Rail-to-Rail Output Swing	Within 35mV of Supplies (R_L =2k)
Packages Offered:
micro SMD package	1.39mm x 1.41mm
MSOP package	3.0mm x 4.9mm
Low Supply Current	<1mA (max)
Shutdown Current	1µA (max)
Versatile Shutdown feature	10µs turn-on
Output Short Circuit Current	10mA
Offset Voltage	±5 mV (max)
Gain-Bandwidth	1MHz
Supply Voltage Range	2.7V-10V
THD	0.18%
Voltage Noise	36

Applications

Portable Communication (voice, data)
Cellular Phone Power Amp Control Loop
Buffer AMP
Active Filters
Battery Sense
VCO Loop

Reliability Metrics

Part Number	Process	Sample Size (EFR)	Device Hours	Long Term Failure Rates (FITS)	MTTF
LMC8101 MDC	P2CMOS	33300	1250000	3	353423344
LMC8101 MWC	P2CMOS	33300	1250000	3	353423344
LMC8101BP	P2CMOS	33300	1250000	3	353423344
LMC8101BPX	P2CMOS	33300	1250000	3	353423344
LMC8101MM	P2CMOS	33300	1250000	3	353423344
LMC8101MMX	P2CMOS	33300	1250000	3	353423344

For more information on Reliablitity Metrics, please click here.

Design Tools

Title	Size in Kbytes	Date	View Online	Download	Receive via Email
Amplifiers Selection Guide software for Windows	7 Kbytes	28-Jul-2003	View

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Application Notes

Title	Size in Kbytes	Date	View Online	Download	Receive via Email
AN-1112: Application Note 1112 Micro SMD Wafer Level Chip Scale Package	309 Kbytes	20-Oct-03	View Online	Download	Receive via Email
Application Note 1112 Micro SMD Wafer Level Chip Scale Package (JAPANESE)	248 Kbytes
AN-1237: Application Note 1237 RSDS™ Flat Panel Display Design Guidelines Part 2	141 Kbytes	14-May-03	View Online	Download	Receive via Email

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[Information as of 15-Jan-2004]

LMC8101 Product Folder