Packaging | Lead-Free Status | European Dir. Compliance | What's driving the move | Strategies Industry Consortia | Lead-Free Reflow Profile | Literature National Semiconductor's Lead-Free Strategy  Phase 1 :  Reclassification of moisture sensitivity level (MSL) for 260oC reflow of all surface mount packages with high volume runs.  This task was completed in December 2000.  This phase will provide customers with information on dry pack requirements for these packages as higher reflow temperatures are used for board assembly. For MSL levels please refer to Selection Guide by Package Type under Packaging.  Select a package and in the table produced for the selected package click the MSL link to get the package MSL information. Phase 2:  Supply of lead-free packages at MSL performance comparable to that in Phase 1. Leaded packages will have a matte Sn finish, while the array packages will have Sn/Ag/Cu balls. This phase was completed in October 2001 for leadframe-based packages and in August 2002 for thin micro SMD. For laminate-based packages and micro SMD (wafer level packages), activities have merged with Phase 3 efforts to provide lead-free packages with enhanced MSL. Phase 3:  Supply of lead-free packages with enhanced MSL performance.  This will be obtained through selection of improved materials of construction and potentially redesign of substrates for the array packages.  This phase will be completed by the end of CY 2003. Lead-free micro SMD packages are available and offered only in the thin version. Packaging | Lead-Free Status | European Dir. Compliance | What's driving the move | Strategies Industry Consortia | Lead-Free Reflow Profile | Literature