Packaging |  Lead-Free Status | European Dir. Compliance | What's driving the move | Strategies Industry Consortia | Lead-Free Reflow Profile | Literature National Semiconductor Corp. - Lead-free Related Publications Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish W. J. Choi, T. Y. Lee, K. N. Tu, N. Tamura, R. S. Celestre, A. A. MacDowell, George T. T. Sheng, Y. Y. Bong, and L. Nguyen, 52nd Electron. Comp. & Tech. Conf., pp. 628-633, May 28-31, San Diego, CA (2002). Tin Whiskers Studied by Focused Ion Beam Imaging and Transmission Electron Microscopy G. T. T. Sheng, C. F. Hu, W. J. Choi, K. N. Tu, Y. Y. Bong, and L. Nguyen, J. Applied Physics, Vol. 92, No. 1, pp. 64-69, July 2002. Lead-Free Wafer Level Chip Scale Package: Assembly and Reliability V. Patwardhan, L. Nguyen, and N. Kelkar, 52nd Electron. Comp. & Tech. Conf., May 28-31, San Diego, CA (2002). A Structured Approach to Lead-Free IC Assembly Transitioning L. Nguyen, R. Walberg, Z. Lin, T. Koh, YY Bong, MC Chua, S. Chuah, and JJ Yeoh, 27th Int. Electron. Manuf. Tech. Symp., Santa Clara, CA, July (2002).  Board Level Reliability of Components with Matte Tin Lead Finish L. Nguyen, R. Walberg, L. Zhou, and T. Koh, 53rd Electron. Comp. & Tech. Conf., May 27-30, New Orleans, LA (2003). Packaging |  Lead-Free Status | European Dir. Compliance | What's driving the move | Strategies Industry Consortia | Lead-Free Reflow Profile | Literature