|  Packaging | Lead-Free Status | European Dir. Compliance | What's driving the move | StrategiesIndustry Consortia | Lead-Free Reflow Profile | Literature
 Lead-Free Reflow Profile The following 260oC reflow profile considered by NEMI (National Electronics Manufacturing Initiative) this year will be used as our benchmark. 
| PROFILE ELEMENTS | CONVECTION or IR |  
| Ramp rate 217oC to peak | 3oC/sec max. |  
| Preheat temperature 150oC (+/-25oC) | 60 to 120 seconds max. |  
| Time 50oC to peak temperature | 3.5 minutes min., 6 minutes max. |  
| Temperature maintained above 217oC | 60-150 seconds |  
| Time within 5oC of actual peak temperature | 10-20 seconds |  
| Peak temperature range | 260oC (-5/+0) oC |  
| Ramp-down rate | 6oC /second max. |  Packaging | Lead-Free Status | European Dir. Compliance | What's driving the move | StrategiesIndustry Consortia | Lead-Free Reflow Profile | Literature
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