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Packaging | Lead-Free Status | European Dir. Compliance | What's driving the move | Strategies Industry Consortia | Lead-Free Reflow Profile | Literature
Lead-Free Reflow Profile
The following 260oC reflow profile considered by NEMI (National Electronics Manufacturing Initiative) this year will be used as our benchmark.
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PROFILE ELEMENTS |
CONVECTION or IR |
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Ramp rate 217oC to peak |
3oC/sec max. |
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Preheat temperature 150oC (+/-25oC) |
60 to 120 seconds max. |
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Time 50oC to peak temperature |
3.5 minutes min., 6 minutes max. |
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Temperature maintained above 217oC |
60-150 seconds |
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Time within 5oC of actual peak temperature |
10-20 seconds |
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Peak temperature range |
260oC (-5/+0) oC |
|
Ramp-down rate |
6oC /second max. |
Packaging | Lead-Free Status | European Dir. Compliance | What's driving the move | Strategies Industry Consortia | Lead-Free Reflow Profile | Literature |