Resources:

Telematics/Infotainment
Connecting driver and passengers with information and entertainment systems.

Drive By Wire Systems
Moving to electrically assisted systems reduces weight, improves efficiency and improves fuel economy.

Driver Automation Systems
Increasing passenger safety is creating new systems with cameras that are extra-sensitive and able to detect quick movements.

42V Systems
The 42V power bus provides the power necessary for Drive-by-Wire systems being adopted to improve fuel economy.

Automotive Die Products
The Die Product Business Unit and Automotive Systems Group are working to make enhanced die products available to the automotive market.

Order your Analog & Interface Products Databook or Website CD ROM

Packaging:

• MDIP      
• Mini SOIC      
• PLCC      
• SOIC Narrow       
• SOIC Wide      
• SOT-223      
• TO 220         
• TO 252      
• TO 263         
• TO 92      
• TSSOP      
• DIE and   WAFER         
• Other Packaging

Online Seminars:

• Considerations in Implementing Chip-on-Board and Multi-Die Assemblies, Mark McClintick (9/17/03) NEW!
• Converting from SMT to Bare Die Assemblies, View Transcript, Mark McClintick (6/26/03) NEW!
• The evolution of voltage regulators with focus on LDO's
• Designing DC-DC Power Supplies Using High Performance Switching Controllers
• Introduction to LVDS
• Imaging System Basics: Building a Camera with CMOS Technology
• Evaluating and Using ADCs - Going Beyond the Mundane
• LMH High Speed Operational Amplifiers
• Boundary SCAN Enables System Level Programming, Configuration, and Mixed-Signal Test

Press Releases

• Industry's smallest 80V Buck regulator from National Semiconductor Provides Cost-effective, Non-isolated Bias Power Supply Design
• National Semiconductor Introduces Industry’s Most Cost-Effective Universal Boundary SCAN Buffer/Transceiver